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Date
25-27 November, 2024
Location
Charles K. Kao Auditorium, Hong Kong Science Park
The 5th International Conference on 3D Construction Printing (5-IC3DcP), hosted by City University of Hong Kong, is set to be held at the Charles K. Kao Auditorium, Hong Kong Science Park. The conference is scheduled from 25th to 27th November 2024.
The main objective of the 5-IC3DcP is to provide a platform for international and local academic and industry partners to exchange their innovative ideas and knowledges in all aspects under 3D Construction Printing, which include established technologies, modelling, simulation, materials, recycled materials, geopolymer, fiber reinforcement and composite materials, testing and standards, applications, Building Information Modelling (BIM), design, optimization, structural and intelligent monitoring, robotics and automation.
This conference is the fifth in the series, with the founder of this conference series being Prof Jay Sanjayan. While the first one was held at Swinburne University of Technology in Melbourne (Australia) in November 2018, the 2nd one was held at Hebei University of Technology in Tianjin in October 2019. The 3rd conference was held online in June 2022 which was mainly organised by Tongji University (China), and in May 2021, Southeast University (China) organized an International Conference on 3D Printing Concrete Materials and Structures which was held online. The most recent was the 4th International Conference on 3D Construction Printing (4-IC3DcP) being held on 19-21 July 2023 at Nanyang Technological University (Singapore).
Gain access to a single day of the 5-IC3DcP conference, providing a focused opportunity to immerse yourself in cutting-edge discussions on Construction 3D Printing.
Experience two full days of the 5-IC3DcP conference with this pass, offering a comprehensive exploration of Construction 3D Printing.
Maximize your 5-IC3DcP conference experience with a 3-day pass, granting you complete access to all sessions throughout the entire event and the banquet.